Visit http://www.mebaker.com for more information. The Baker Vertical Continuous Plater (VCP) is equipped with high speed electrolytic plating cells designed for today's new generation HDI printed circuit board (PCB) production. This is made possible through a selective plating and subsequent soft/differential etching process, removing only the thin seeded layer, and therefore eliminating the need for a metallic etching mask and the use of conventional bulk metal etching chemistry. This product is a new core competence offering, designed to handle flexible printed circuits (FPCs) in sheet form in a vertical orientation. Features include a unique electrolytic technology that minimizes the formation of planar surface copper nodules, a major contributor in FPC fabrication yield.
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